<?xml version='1.0' encoding='UTF-8'?><codeBook xmlns="ddi:codebook:2_5" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="ddi:codebook:2_5 https://ddialliance.org/Specification/DDI-Codebook/2.5/XMLSchema/codebook.xsd" version="2.5"><docDscr><citation><titlStmt><titl>Dataset IC type DIP : 7400, 7402, 7404, 7408, 7432, 7490, 741, 555, 4051, 324</titl><IDNo agency="DOI">doi:10.34820/FK2/78G3LC</IDNo></titlStmt><distStmt><distrbtr source="archive">Telkom University Dataverse</distrbtr><distDate>2025-11-12</distDate></distStmt><verStmt source="archive"><version date="2025-11-12" type="RELEASED">1</version></verStmt><biblCit>Fushshilat, Iman; Achmad Rizal; Willy Anugrah Cahyadi, 2025, "Dataset IC type DIP : 7400, 7402, 7404, 7408, 7432, 7490, 741, 555, 4051, 324", https://doi.org/10.34820/FK2/78G3LC, Telkom University Dataverse, V1</biblCit></citation></docDscr><stdyDscr><citation><titlStmt><titl>Dataset IC type DIP : 7400, 7402, 7404, 7408, 7432, 7490, 741, 555, 4051, 324</titl><IDNo agency="DOI">doi:10.34820/FK2/78G3LC</IDNo></titlStmt><rspStmt><AuthEnty affiliation="Telkom University">Fushshilat, Iman</AuthEnty><AuthEnty affiliation="Telkom University">Achmad Rizal</AuthEnty><AuthEnty affiliation="Telkom University">Willy Anugrah Cahyadi</AuthEnty><othId role="Researcher">Iman Fushshilat</othId><othId role="Supervisor">Achmad Rizal</othId><othId role="Supervisor">Willy Anugrah Cahyadi</othId></rspStmt><prodStmt><producer affiliation="Universitas Telkom">Iman Fushshilat</producer><prodDate>2025-05-05</prodDate><prodPlac>Bandung, Indonesia</prodPlac></prodStmt><distStmt><distrbtr source="archive">Telkom University Dataverse</distrbtr><contact affiliation="Telkom University" email="imanfushshilat@student.telkomuniversity.ac.id">Fushshilat, Iman</contact><depositr>Fushshilat, Iman</depositr><depDate>2025-11-12</depDate></distStmt></citation><stdyInfo><subject><keyword>Computer and Information Science</keyword><keyword>Engineering</keyword></subject><abstract date="2025-11-12">Terdiri dari total 2016 gambar IC bertipe DIP yang terbagi dalam 10 Kelas: 7400, 7402, 7404, 7408, 7432, 7490, 741, 555, 4051, 324</abstract><sumDscr/><notes>Consisting of a total of 2016 DIP-type IC images divided into 10 classes: 7400, 7402, 7404, 7408, 7432, 7490, 741, 555, 4051, 324.
Please cite the relevant paper/article and also the dataset link before using this dataset.</notes></stdyInfo><method><dataColl><sources/></dataColl><anlyInfo/></method><dataAccs><notes type="DVN:TOU" level="dv">CC0 Waiver</notes><setAvail/><useStmt/></dataAccs><othrStdyMat><relPubl><citation><biblCit>This dataset was used in the following papers:
1. An Optimized Deep Learning Pipeline for Used IC Classification Integrating DenseNet121 with Fine Tuning
2. An Efficient Pipeline for Automated Integrated Circuit Classification using Optimized Data Augmentation and MobileNetV2
3. Classification of Used Integrated Circuit Components Using Deep Learning Through Data Augmentation Pipeline Optimization

Please cite this dataset link and also cite these papers before using this dataset.</biblCit></citation></relPubl></othrStdyMat></stdyDscr><otherMat ID="f18506" URI="https://doi.org/10.34820/FK2/78G3LC/K3QOMT" level="datafile"><labl>DATASET_IC.zip</labl><txt>Terdiri dari total 2016 gambar IC bertipe DIP yang terbagi dalam 10 Kelas: 7400, 7402, 7404, 7408, 7432, 7490, 741, 555, 4051, 324.
Dimohon mensitasi paper/artikel terkait sebelum menggunakan dataset ini

Consists of a total of 2016 DIP-type IC images divided into 10 classes: 7400, 7402, 7404, 7408, 7432, 7490, 741, 555, 4051, 324.
Please cite the relevant paper/article before using this dataset.</txt><notes level="file" type="DATAVERSE:CONTENTTYPE" subject="Content/MIME Type">application/zip</notes></otherMat></codeBook>