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Part 1: Document Description
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Citation |
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Title: |
[Manuscript] Enhancing Thermal-Shock Reliability of a Sleeveless Power Inductor Assembly upon Reflow Soldering |
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Identification Number: |
doi:10.34820/FK2/8HZIVH |
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Distributor: |
Telkom University Dataverse |
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Date of Distribution: |
2022-04-01 |
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Version: |
1 |
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Bibliographic Citation: |
SJAFRIZAL, TEDDY, 2022, "[Manuscript] Enhancing Thermal-Shock Reliability of a Sleeveless Power Inductor Assembly upon Reflow Soldering", https://doi.org/10.34820/FK2/8HZIVH, Telkom University Dataverse, V1 |
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Citation |
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Title: |
[Manuscript] Enhancing Thermal-Shock Reliability of a Sleeveless Power Inductor Assembly upon Reflow Soldering |
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Identification Number: |
doi:10.34820/FK2/8HZIVH |
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Authoring Entity: |
SJAFRIZAL, TEDDY (Fakultas Rekayasa Industri, Production and Manufacturing System) |
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Distributor: |
Telkom University Dataverse |
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Access Authority: |
SJAFRIZAL, TEDDY |
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Depositor: |
SJAFRIZAL, TEDDY |
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Date of Deposit: |
2022-04-01 |
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Study Scope |
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Keywords: |
Engineering |
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Abstract: |
This manuscipt has been presented at the 2019 1st International Conference on Engineering and Management in Industrial System |
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Methodology and Processing |
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Sources Statement |
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Data Access |
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Notes: |
CC0 Waiver |
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Other Study Description Materials |
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Related Publications |
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Citation |
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Identification Number: |
https://doi.org/10.2991/icoemis-19.2019.50 |
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Bibliographic Citation: |
Fajrina, F., Sjafrizal, T., & Anugraha, R. (2019, November). Enhancing Thermal-Shock Reliability of a Sleeveless Power Inductor Assembly upon Reflow Soldering. In 2019 1st International Conference on Engineering and Management in Industrial System (ICOEMIS 2019) (pp. 367-372). Atlantis Press. |
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Label: |
Fildzah_Accepted_Manuscript.pdf |
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Notes: |
application/pdf |