[Manuscript] Enhancing Thermal-Shock Reliability of a Sleeveless Power Inductor Assembly upon Reflow Soldering

10.34820/FK2/8HZIVHSJAFRIZAL, TEDDYTEDDYSJAFRIZAL 0000-0002-2075-8316Fakultas Rekayasa Industri, Production and Manufacturing System[Manuscript] Enhancing Thermal-Shock Reliability of a Sleeveless Power Inductor Assembly upon Reflow SolderingTelkom University Dataverse2022EngineeringSJAFRIZAL, TEDDYTEDDYSJAFRIZALFakultas Rekayasa Industri, Production and Manufacturing System2022-04-012022-04-0110.2991/icoemis-19.2019.50954206application/pdf1.2CC0 WaiverThis manuscipt has been presented at the 2019 1st International Conference on Engineering and Management in Industrial System