{"@context":"http://schema.org","@type":"Dataset","@id":"https://doi.org/10.34820/FK2/8HZIVH","identifier":"https://doi.org/10.34820/FK2/8HZIVH","name":"[Manuscript] Enhancing Thermal-Shock Reliability of a Sleeveless Power Inductor Assembly upon Reflow Soldering","creator":[{"name":"SJAFRIZAL, TEDDY","affiliation":"Fakultas Rekayasa Industri, Production and Manufacturing System"}],"author":[{"name":"SJAFRIZAL, TEDDY","affiliation":"Fakultas Rekayasa Industri, Production and Manufacturing System"}],"datePublished":"2022-04-01","dateModified":"2022-04-02","version":"1","description":["This manuscipt has been presented at the 2019 1st International Conference on Engineering and Management in Industrial System"],"keywords":["Engineering"],"citation":[{"@type":"CreativeWork","text":"Fajrina, F., Sjafrizal, T., & Anugraha, R. (2019, November). Enhancing Thermal-Shock Reliability of a Sleeveless Power Inductor Assembly upon Reflow Soldering. In 2019 1st International Conference on Engineering and Management in Industrial System (ICOEMIS 2019) (pp. 367-372). Atlantis Press."}],"license":{"@type":"Dataset","text":"CC0","url":"https://creativecommons.org/publicdomain/zero/1.0/"},"includedInDataCatalog":{"@type":"DataCatalog","name":"Telkom University Dataverse","url":"https://dataverse.telkomuniversity.ac.id"},"publisher":{"@type":"Organization","name":"Telkom University Dataverse"},"provider":{"@type":"Organization","name":"Telkom University Dataverse"},"distribution":[{"@type":"DataDownload","name":"Fildzah_Accepted_Manuscript.pdf","fileFormat":"application/pdf","contentSize":954206,"@id":"https://doi.org/10.34820/FK2/8HZIVH/VZONII","identifier":"https://doi.org/10.34820/FK2/8HZIVH/VZONII","contentUrl":"https://dataverse.telkomuniversity.ac.id/api/access/datafile/4995"}]}